型号/品牌/封装
品类/描述
库存
价格(含税)
资料
描述:
Conn Unshrouded Header HDR 11POS 1mm Solder ST SMD
1438
描述:
CONN SOCKET 30POS 2MM VERT SMD
1827
品牌:
FCI Electronics (法马通)
描述:
Conn Unshrouded Header HDR 10POS 2.54mm Solder ST SMD Tube
8318
品牌:
FCI Electronics (法马通)
2638
描述:
CONN HDR STR STACK 24POS 2MM SMD
9374
品牌:
FCI Electronics (法马通)
描述:
CONN HEADER 25POS 1MM VERT SMD
4117
描述:
2.54毫米（ .100 ）间距SL ™线对板头，扁平，表面贴装，单列，直角， 0.120口袋，带罩，带压入塑料钉， 9电路 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits
7483
描述:
Conn Socket Strip SKT 20POS 2.54mm Solder ST SMD Bulk
9911
描述:
Conn Shrouded Header HDR 20POS 2.54mm Solder ST SMD T/R
1080
品牌:
FCI Electronics (法马通)
描述:
CONN RECEPT 40POS 0.8MM DUAL SMD
8261
品牌:
FCI Electronics (法马通)
描述:
Conn Unshrouded Header HDR 6POS 2mm Solder ST SMD T/R
4278
描述:
AMPHENOL FCI 52601-S10-8LF Wire-To-Board Connector, 2.54mm, 10Contacts, Header, Quickie Series, Surface Mount, 2Rows
6312
描述:
0.4mm, 0.5mm, 0.6mm, 0.8mm, 1mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors
3054
描述:
3.00毫米（ 0.118 “ ）间距微飞度3.0 BMI ™接头，表面安装，双排，直角，无管理单元塑料栓锁电路板，电路6 ，锡（Sn ）镀层 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 6 Circuits, Tin (Sn) Plating
5131
品牌:
FCI Electronics (法马通)
描述:
Conn Socket Strip RCP 13POS 2.54mm Solder ST SMD Tube
3520
描述:
DF13 系列 14 位置 单排 1.25 mm 间距 线对板 排针
4251
品牌:
FCI Electronics (法马通)
描述:
0.8mm Bergstak® 系列 这些 FCI Bergstk® 高密度 0.8mm 节距表面安装连接器用于板到板堆叠应用，可以节省空间。 刀片线束触头允许"剥离"并可防止"残断" ### 0.8mm 电路板到电路板 - FCI 来自 FCI 的 Bergstak® 系统是高密度平行板到板连接器，可配置为各种不同印刷电路板堆叠高度。 这些 Bergstak® 连接器极化、有大引入线角度、带精确触点定位，确保精确匹配校准和可靠性。
2989
描述:
1.27毫米（ .050 “ ）间距PICOFLEX SMT锁存垂直头， 22电路，锡（Sn ） ，镀黑 1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 22 Circuits, Tin (Sn) Plating, Black
7426
描述:
2.00毫米（ .079 “ ）间距的Milli-电网™插座，表面贴装，顶面入口， 0.38μm （ 15μ ”），金（Au ），电镀，无盖，带定位钉， 34电路，无铅 2.00mm (.079") Pitch Milli-Grid™ Receptacle, Surface Mount, Top Entry, 0.38μm (15μ")Gold (Au) Plating, without Cap, with Locating Peg, 34 Circuits, Leadfree
4600
描述:
2.54毫米（ .100“ ）间距C- Grid®头，表面贴装，双排，垂直，罩， 36电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，无压入塑料钉 2.54mm (.100") Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, Shrouded, 36 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, without Press-fit Plastic Pegs
6966
描述:
板对板与夹层连接器 VERT CARD EDGE 4WAY 1.6mm THICKNESS
1478
描述:
Conn Differential Pair SKT 8Power/32Signal POS 0.635mm Solder ST SMD Tray
3848
描述:
Conn Micro High Speed Terminal Strip SKT 40Signal/12Ground POS Solder ST SMD
5920
描述:
Conn Micro High Speed Socket Strip SKT 156POS 0.635mm Solder ST SMD
5059
描述:
Conn Micro High Speed Terminal Strip HDR 208POS 0.635mm Solder RA Thru-Hole/SMD
6166
描述:
Conn Differential Pair HDR 32POS 0.63mm Solder ST SMD
7035
描述:
QRM8 Series Slim Body Ground Plane Headers These Board to Board QRM8 Series connectors have 0.25 μm Gold plated contacts with Tin plated Tails. This range of Board to Board QRM8 Series connectors are available: with and without Guide Posts, straight or right angle, 2, 5 or 7 mm body heights. Alignment Pins are included in this rangeThe design of the Board to Board QRM8 Series connector includes samtec"s Edge Rate contacts. QRM8-xxx-**02.0**-x-x-x-xx have a Body height of 2 mm QRM8-xxx-**07.0**-x-x-x-xx have a Body height of 7 mm QRM8-xxx-xx.x-x-x-x-**GP** have Guide Posts QMR8-xxx-xx-x-**RA-GP** have a horizontal orientation with Guide Posts ### 注 Mates with QRF8 Series Sockets see stock number 767-7082 typical. Guide Post versions require Guide Post mating articles. ### 0.8mm 板对板 - Samtec 兼容性表 --- 系列名称 | 配接对象 BSE | BTE CLE | FTE QSE | QTE ERF8 | ERM8 QRF8 | QRM8 额定电流 | BSE、BTE、QTE 和 QSE 系列：2A CLE 和 FTE 系列：0.75A ---|--- 触点材料 | BSE、BTE、QTE、QSE 和 FTE 系列：磷青铜 CLE 系列：铍铜 触点电镀 | 金 工作温度范围 | -65°C → +125°C
8193
描述:
Conn Differential Pair SKT 28POS 0.8mm Solder ST SMD
8255
描述:
Conn High Speed Socket Strip SKT 40POS 0.8mm Solder ST SMD T/R
6828
描述:
Conn Socket Strip SKT 40POS 0.8mm Solder ST SMD T/R
1247
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